Warpage and Stress Analysis of Three Dimensional Lead-Frame Type Packages
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 93 === The three dimensional package is composed of stacked components, and the structure is more complicated than the conventional package. The mismatch of material properties among components induce package warpage and stress, and the combination of components as w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63411720137429788077 |