| Summary: | 碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 93 === The three dimensional package is composed of stacked components, and the structure is more complicated than the conventional package. The mismatch of material properties among components induce package warpage and stress, and the combination of components as well material properties and geometrical dimensions of components affect the package warpage and stresses.
The linear and sequential processing models of three dimensional lead-frame type package are built to simulate the package warpage and stresses during manufacturing processes. The package warpage is measured by the profilometer to verify the accuracy of the simulation model. The package warpage and stresses predicted by both models are compared to show the difference. The effects of different combinations of various die and substrate thickness as well material properties of molding compound on the package warpage and die stresses are discussed. The effect between substrate and substrate substitute on the delamination during manufacturing is also discussed. Also, the effect of opening hole on the die pad on the package warpage and stresses of both single and multiple die package is compared. Further more, a special package, SOP70 Package in Package, which combines both two and three dimensional package technology, is demonstrated to discuss the effect of various die thickness on the package warpage and die stresses.
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