Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design

碩士 === 國立雲林科技大學 === 電子與資訊工程研究所 === 93 === Traditional low speed I/O is progressively replaced by Low Voltage Differential Signaling (LVDS) Interface. In recent years, the third generation I/O PCI Express will become major standard I/O architecture and will become main motherboard architecture in the...

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Main Authors: Yong-Long Lai, 賴永隆
Other Authors: Ming-Hwa Sheu
Format: Others
Language:en_US
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/35441821791055134982
id ndltd-TW-093YUNT5393058
record_format oai_dc
spelling ndltd-TW-093YUNT53930582015-10-13T11:54:00Z http://ndltd.ncl.edu.tw/handle/35441821791055134982 Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design 前瞻系統晶片匯流排封包傳送之界面電路設計 Yong-Long Lai 賴永隆 碩士 國立雲林科技大學 電子與資訊工程研究所 93 Traditional low speed I/O is progressively replaced by Low Voltage Differential Signaling (LVDS) Interface. In recent years, the third generation I/O PCI Express will become major standard I/O architecture and will become main motherboard architecture in the future. So the interface face with serial transfer is important. Further the complexity of SoC is more and more. There needs advance technology on Link architecture system, circuit design method and design rule flow for SoC. Becoming serial transmission is target. In this thesis, it develops the link architecture for complete packet switching protocols on NoC. Using method of segment function on layer in internet system application to NoC(Network on Chip). In protocol design it includes Transaction layer, Data link layer and Physical layer. It supports the function of flow control, error retry, etc. The capability of transaction layer is accept read or write request of IP. And build a request packet delivers to the Data link layer. The duty of Data link layer is ensuring that packet transfer is correct and reliable. Using data link layer packet to product response of ACK or NACK and support information of flow control. The work of physical layer is supported transmission of serial at point to point. Bring up the extendable hardware design to contain variety system platform. We also use a software tool to design NoC interface which allow to user design. Purpose is to attain high speed transmission of SoC in feature. The layout of the SPNI instance described above, which has an area of 0.82 mm2 in a 0.18-μm technology. Ming-Hwa Sheu 許明華 2005 學位論文 ; thesis 61 en_US
collection NDLTD
language en_US
format Others
sources NDLTD
description 碩士 === 國立雲林科技大學 === 電子與資訊工程研究所 === 93 === Traditional low speed I/O is progressively replaced by Low Voltage Differential Signaling (LVDS) Interface. In recent years, the third generation I/O PCI Express will become major standard I/O architecture and will become main motherboard architecture in the future. So the interface face with serial transfer is important. Further the complexity of SoC is more and more. There needs advance technology on Link architecture system, circuit design method and design rule flow for SoC. Becoming serial transmission is target. In this thesis, it develops the link architecture for complete packet switching protocols on NoC. Using method of segment function on layer in internet system application to NoC(Network on Chip). In protocol design it includes Transaction layer, Data link layer and Physical layer. It supports the function of flow control, error retry, etc. The capability of transaction layer is accept read or write request of IP. And build a request packet delivers to the Data link layer. The duty of Data link layer is ensuring that packet transfer is correct and reliable. Using data link layer packet to product response of ACK or NACK and support information of flow control. The work of physical layer is supported transmission of serial at point to point. Bring up the extendable hardware design to contain variety system platform. We also use a software tool to design NoC interface which allow to user design. Purpose is to attain high speed transmission of SoC in feature. The layout of the SPNI instance described above, which has an area of 0.82 mm2 in a 0.18-μm technology.
author2 Ming-Hwa Sheu
author_facet Ming-Hwa Sheu
Yong-Long Lai
賴永隆
author Yong-Long Lai
賴永隆
spellingShingle Yong-Long Lai
賴永隆
Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design
author_sort Yong-Long Lai
title Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design
title_short Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design
title_full Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design
title_fullStr Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design
title_full_unstemmed Advance System on a Chip Bus Packet Based Transaction Interface Circuit Design
title_sort advance system on a chip bus packet based transaction interface circuit design
publishDate 2005
url http://ndltd.ncl.edu.tw/handle/35441821791055134982
work_keys_str_mv AT yonglonglai advancesystemonachipbuspacketbasedtransactioninterfacecircuitdesign
AT làiyǒnglóng advancesystemonachipbuspacketbasedtransactioninterfacecircuitdesign
AT yonglonglai qiánzhānxìtǒngjīngpiànhuìliúpáifēngbāochuánsòngzhījièmiàndiànlùshèjì
AT làiyǒnglóng qiánzhānxìtǒngjīngpiànhuìliúpáifēngbāochuánsòngzhījièmiàndiànlùshèjì
_version_ 1716850816819658752