A Study of Silver Nanofluid on Heat Pipe Thermal Performance

• Main Authors: Shin-Yu Yang, 楊世宇
• Other Authors: 康尚文
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/52788048485429798650

碩士 === 淡江大學 === 機械與機電工程學系碩士班 === 93 === Nanofluid is employed as working medium for conventional 211µm width×217µm depth grooved circular heat pipe. The nanofluid used in this study is an aqueous solution of 10nm and 35nm diameter silver nanoparticles. The experiment was performed to measure temperature distribution and compare thermal resistance of heat pipe with nanofluid and with DI-water. The tested concentrations of nanoparticles range from 1mg/l to 100mg/l. The condenser section of the heat pipe was attached to a heat sink, which was cooled by water supplied from a constant temperature bath maintained at 40℃. At a same charge volume, the measured temperature distribution of nanofluid filled heat pipe have demonstrated that the thermal resistance decreases 30%~75% compare to DI-water case at input power of 30~60W. The measured results also show that the thermal resistances of heat pipe decrease as an increase of the size and the concentrations of silver nanoparticles.