The Study on the Joining of Ceramic/Copper using Ultrasonics-Aided Activated Solder Technique
碩士 === 國立臺北科技大學 === 機電整合研究所 === 93 === The aim of this study was to develop a novel join process by using a low temperature activated solder that be added activated elements, such as: Ti, Ce and Ga in the Sn-based filler metal. The mechanics of ultrasonic vibration be used to aid in this process. Pr...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/s85524 |