| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 93 === The purpose of this article is to establish two kinds of drop test models for 3C products and to study the influence factors and trends from it. First, through setting a simple model, it makes the simulated input parameter to trend to reasonable and correct by the experienced measurement and the length convergent of model’s elements. Second, by using simulated way, the simulated subject do drop test in many kinds of parameter’s environment which are included with one corner- three edges- six faces, different drop height, different shell thickness, different strike angle of the object to the ground ,different position of Charge Coupled Device and etc. At last, we may find the best combination parameter out via Taguchi method. Further, applying to Reverse Engineering, it can use non-contact optical measurement system to rebuild the prototype of the shell of cellular phone and lead into the software of limited factor to analyze the impact G value occurred by attacking the ground of cellular’s shell. The result same with Reverse Engineering show that it will generate the smallest impact G when test object is on one of the following situation-lower drop height or thicker shell or smaller strike angle to the ground or the position of CCD more near the center symmetry.
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