| Summary: | 碩士 === 國立臺北科技大學 === 電機工程系所 === 93 === This study focused on the use of DC magnetic sputtering on flexible substrate (PC) for plating transparent conductive film (ITO), and modified the production parameters to discuss the relationship to parameters to film structure and photoelectric characteristics. Although glass substrate is widely used by the photoelectric and semiconductor industries, as the future products will have features of compact, flexibility, and durability, plastic substrate with such features will be the mainstream. Plastic substrate has advantages, but is still incomparable to glass substrate in terms of heat resistance and heat expansion; the head expansion coefficient of plastic substrate (70.2×10-6 cm/cm/C ) and ITO (7.2×10-6 cm/cm/C ) will lead to problem of heat stress on film, and result in break of ITO film during sputtering. The weakness in heat resistance will cause poor conductivity, and even deformation in the high temperature processing.
Concerning the abovementioned weakness of the plastic substrate, this study used two types of substrates, conventional PC and PC with hardened coating, which intends to bring the heat expansion coefficients of the ITO and substrate to reduce the heat stress. The results showed that substrate with hardened coating has solved the problem of heat stress. Also, since this study was conducted in low temperature environment, the results of X-ray diffraction analysis showed that the sputtered film was noncrystalline, though with inferior photoelectric characteristics to crystalline, it is more efficient in the etching processing. The four-probe and spectrum test on the photoelectric characteristics showed that the optimal resistance is 7.652×10-4 Ω-cm, and light transmission is above 85 %.
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