Summary: | 碩士 === 樹德科技大學 === 經營管理研究所 === 93 === Since the technology flourished and the structure of the industries changed, they brought the drastic enterprise competition. Therefore, the enterprise has to adopt the professional development to reduce the cost, improve the resource allocation and expand the scale to satisfy the customer’s demand. Those actions are to reach the business goal of the maximum profit. Nowadays, the enterprises face the new labor retirement policy. Meanwhile, they have to adopt the professionalized actions and outsource the non-core business. Furthermore, they apply the core competence (professional skills)to proceed the development and innovation to reduce the business operating cost, and enhance the enterprise competitive advantage.
The 21st century is the information technology era. The information (68%) is the most applied field in the semiconductor industry, and the communication system (9%) is the second most. Computers and peripherals, Internet, PDA, mobile phones, LCD monitors etc., those hi-tech products has become the necessities of the human being. The manufacturing vendors continue to produce the hi-tech products to satisfy the consumers so that the semiconductor integrated chip industry has become the most important part of the modern life.
The study combined transaction cost and enterprise core competence to adopt the pattern-built and case study methodology to explore the network governance of the semiconductor integrated chip industry. Using the IC manufacturing industry as the subject, it examined the extension of the network among the industry. Furthermore, it comprehended the network governance by investigating the network relationship between TSMC and UMC.
The study found that Taiwan semiconductor industry exist the close network relationship. In order to follow the market trend and enhance the profit, IC manufacturing vendors adopt the appropriate network to adjust the market change. Network governance is one of the critical point for the enterprise decision making.
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