Using Nanoindentation and Nanoscratach to Measure the Mechanical Properties of Evaporation Thin Films

• Main Authors: SUN, CHANG-EN, 孫長恩
• Other Authors: CHANG, JUI-CHING
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/07076587448464355985

碩士 === 聖約翰技術學院 === 自動化及機電整合研究所 === 93 === This study uses nanoindentation and nanoscratch to measure the mechanical properties of the evaporation aluminum and copper thin films in association with a nanoindentation simulation by way of the finite element method. The thin film is accumulated on the silicon wafer substrate by using the physical vapor deposition method in a resistive heating evaporator. The mechanical properties are then determined by the indentation test and lateral force test produced by nanoindenter and nanoscratch. The results show that, as the aluminum thin film is 500nm in thickness and the indentation depth increases from 100nm to 400nm, the Young’s modulus increases from 96GPa to 180GPa and the hardness increases from 0.9GPa to 3.0GPa. Moreover, both the Young’s modulus and the hardness decrease as the thickness of the thin film increases. Similarly, as the copper thin film is 500nm in thickness and the indentation depth increases from 100nm to 400nm, the Young’s modulus increases from 128GPa to 161GPa while the hardness increases from 2.8GPa to 3.5GPa. The results show the mechanical properties increase with the increasing indentation depth, which represent the substrate has a significant effect on the mechanical properties of the thin films. Besides, the nanoscratch results show that the friction factor also increases as the scratch depth increases. Furthermore, a thinner film thickness makes a larger friction factor. In the finite element analysis, ANSYS/LS-DYNA is used to simulate the thin film specimen and the indenter by substituting the mechanical properties determined from the experiment. It found that the indentation depth of the numerical simulation agrees well with the experimental result.