An RDL Routing System for Flip-Chip Design
碩士 === 國立臺灣大學 === 電子工程學研究所 === 93 === The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this thesis, we propose the first router for the flip-chip package. The router can redistribute net...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74567081667478559246 |