Study of Control Mechanism for Fluidic Self-Assembly

• Main Authors: Chia Liang Hsu, 許嘉良
• Other Authors: J. Andrew Yeh
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/91152988184386228196

碩士 === 國立清華大學 === 微機電工程研究所 === 93 === The Pick and Place technology is very popular in the electronics packaging. However, as the component dimension shrinks down dramatically, not only the packaging cost will be sky high and it also creates some problems in the process feasibility and component reliability. We analyze the change of dominant forces when component scale is in the range of nano-meter to mini-meter. It indicates that different packaging methods must be developed beside the costly pick and place process. Self-assembly is the most promising solution, especially the fluidic self-assembly (FSA) technique which is well studied and have high volume throughput in the electronics packaging. However, the design or process of control mechanism has their own difficulties such as the stability and reproducibility of control mechanism and the compatibility of process with post process. Buy using the DOE technique for FSA process, we optimize the surface treatment of devices and substrates and couple with the design of surface feature. These improve stability of FSA and easy to integrate with the post process.