Fabrication and Package of Flip Chip Type Micro Gyroscope
碩士 === 國立清華大學 === 工程與系統科學系 === 93 === In terms of the semiconductor and MEMS technology, package is the process that all the devices have to go through before being taking out of the laboratory. In the MEMS field, most of the ways of packaging are adopted from those of the traditional IC packaging,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90943670945242189012 |