Using CTPN to Model a Hybrid Material Handling System in a 300 mm Fab

碩士 === 國立清華大學 === 工業工程與工程管理學系 === 93 === This study investigates the transportation problems in the semiconductor fabrication. Due to the weight and size of the 300 mm wafer lot, it is difficult to transport lots by operators, and therefore the automated material handling system (AMHS) is widely emp...

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Bibliographic Details
Main Authors: Chang, Pei-Lun, 張培倫
Other Authors: Liu, Chih-Ming
Format: Others
Language:en_US
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/70070981111778167301