The Development of an Automatic Desktop Phase-Shifting Shadow Moire System
碩士 === 國立屏東科技大學 === 機械工程系 === 93 === One of the main factors makes the warpage of the BGA electronic packages is the difference of thermal expansion coefficient between materials. A laser point-to-point measuring method is primary used to measure the warpage now by off-line sampling inspection. Neve...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88242747420796797909 |