| Summary: | 碩士 === 國立彰化師範大學 === 機電工程學系 === 93 === This research includes design and implementation of high resolution delta-sigma A/D converter, and design and construction of thermal imager for micro-analysis.
Today, electronic technology is growing startling. For reducing device power consumption and growing system stability, digital logic circuits are much more important for electronic applications in this time. But analog signals are unavoidable in natural life, the bridge is A/D converter to connect analog signals and digital signals. It becomes necessary for electronic circuit systems.
In A/D conversion technique, delta-sigma is popular with engineers. Because of delta-sigma technique used much more digital circuits than analog, so the power consumption is much more less than other A/D conversion techniques. For the performance of resolution, the request of analog circuits is less, but LSB (least significant bit) is still kept very well. These are its’ advantages for LSI beyond the other A/D conversion techniques.
This research provides a method of A/D conversion which is similar to delta-sigma structure. Without complex mathematic operations and analog circuits, it could reach high resolution and better stability.
This paper includes five chapters, which include introduction of A/D converter, theory of A/D conversion, design and implementation several types of A/D converter relative to delta-sigma structure. It could achieve low power consumption and high resolution, and be used in portable electronic equipments efficaciously. Under many simulations and experiments, these circuits have been proved and verified very successful as a bridge of A/D converter to connect analog signals and digital signals.
Besides, the temperature inspections for industry and medicine are highly developed in this time. The temperature distributions are very important, even are critical issues for examination of patients and many industrial processes. This material will introduce our research works of design and construction of thermal imager for micro analysis.
First, by using a 4x4 thermopile array module, we calibrate the area size of monitoring without optical system. Then we setup an optical system with microscope structure by using two Germanium lenses. After all these setup, more subsequent temperature calibrations and ambient temperature compensations are made. We apply the thermal imager of micro-analysis to the high power electronics as a demonstration. Finally, the temperature distribution of the sample chip is observed, and more analysis is made.
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