Cross-Interaction of Ni and Cu in Sn
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 93 === In a real solder joint, the solder is always sandwiches between two metals. And the Ni/solder/Cu combination is one of the most common one in microelectronics devices. The objective of this study is to investigate whether the cross-interaction will occur bet...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02562079100995322371 |