| Summary: | 碩士 === 國立交通大學 === 機械工程系所 === 93 === In this experiment, a series of columnar array served as punches were fabricated on silicon wafer by semiconductor manufacture process. In the mean time HA/PLLA membranes were prepared by spin coating upon the surface of wafer. Then the membranes were punched by the columnar array at elevated temperature. Holes on HA/PLLA membranes which were not fully penetrated were then processed by RIE. In order to reduce the cost, porous HA/PLLA membranes were also manufactured by punching with two shifted molds. Finally the porous membranes were tested for physical properties and cell compatiability.
Based on the experiment results, the depth of the column in the mold is about 100μm, diameter of the column on the top is about 33μm, on the bottom is about 44μm, ICP etching rate is about 2μm/min, aspect ratio is about 1: 2.27. The etching rate of RIE is about 0.625μm/sec. Both the hole diameter and the thickness in HA/PLLA membranes were very precise. Cell test results show that HA/PLLA memberanes have good biocompatibility and promote fibroblast growth.
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