Analysis on the Effect of Wire Density on Wire Sweep
碩士 === 國立交通大學 === 機械工程系所 === 93 === Because the electric products trend to become lighter, thinner, smaller and multi-functional, semiconductor industry has to focus on IC chip scale-down. Meanwhile, IC packaging technology must also become more advanced to be compatible with this trend. Wires weep...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94191225008330454650 |