Analysis on the Effect of Wire Density on Wire Sweep

• Main Authors: Wei-Ti Chien, 簡維德
• Other Authors: Ching-Hua Hung
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/94191225008330454650

碩士 === 國立交通大學 === 機械工程系所 === 93 === Because the electric products trend to become lighter, thinner, smaller and multi-functional, semiconductor industry has to focus on IC chip scale-down. Meanwhile, IC packaging technology must also become more advanced to be compatible with this trend. Wires weep is one of the important issues in packaging technology. With the size-decreased chips and the number-increased I/Os, the problems due to wire sweep become more and more serious and often reduce the yield of products; so to control the amount of sweep within an acceptable range become one of the key points in advanced packaging technology. Currently, the most cost effective solution to predict and correct wire sweep is to use numerical simulation to obtain the optimum process parameters and mold cavity design. A new simulation scheme for wire sweep analysis evolved from traditional methods was be discussed in this research. A comparison of results from both simulation methods was conducted for different wire distribution densities. The change of the wire sweep behavior according to the wire distribution density was concluded and discussed.