The Theoretical Analysis for the Effect of porous structure of pad on the Slurry Flows and Tribological Performances Arising at the Chemical Mechanical Polishing of Cu-Film Wafers
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === Abstract There are many parameters that effect the CMP in the process. The rule that porous structure of pad plays in CMP is very complicated and there are not many researches mentioned about it. Actually the porous structure of pad is significant for removin...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79264822129796314840 |