The Influence of a Novel Packaging Structure on MEMS Devices Performance
碩士 === 國立成功大學 === 微電子工程研究所碩博士班 === 93 === This thesis is suggested a novel packaging technology which is made for MEMS devices. This novel packaging is different from conventional packaging such as BGA, Flip-chip which need to bond gold wires to transmit signal. Because MEMS devices are easy broke...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68934278514573015465 |