Investigation on Bonding and Material Reaction Behavior between Tin-Zinc series Lead-Free Solders and Substrate.
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 93 === This study investigated the bonding behavior between Sn-Zn series lead-free solder and substrate. The bonding strength of the solder ball was measured by shear and pull test. The BGA package was connected to the OSP/Cu print circuit board. After the reliab...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/57017888324922554929 |