The Scorecard Application on Cu CMP New Process Release Management and Evaluation

• Main Authors: Tien-Chen Hu, 胡天鎮
• Other Authors: J.F Wang
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/17307393649489223211

碩士 === 國立成功大學 === 工學院工程管理專班 === 93 === 　Semi-conductor process technology is advancing promptly unexpected. The new evaluation procedures on wafer production is unlike what it used to be with 0.18μprocess. In the new age of process technology, production yield is eventually influenced by the parameters changed in process. Therefore, the methods in evaluating the changes in new process technology on production line are essentially important. The focus of new process is primarily on the changes in process in the past; it is normally neglected with its effects to overall process integration. The changed parameters in new process may give great effects to process integration parameters, thereby; a great loss may be resulted in wafer yields. 　The research on new process technology will adapt the use of balanced scorecard to investigate the possible effects from the process changes. In semi-conductor processes, an advanced and complicated technology, Copper Chemical Mechanical Polishing (CMP), will demonstrate the application with the scorecard, which provides an effective way for new process changes on the production line. The use of balanced scorecard provides a various emphasis to the process integration parameters. Performance measurement is achieved based the result of the balanced scorecard. A thorough analysis on the scorecard result can easily realize on how new process changes influence overall process integration.