Reliability Study of a Flip Chip Type CMOS Image Sensor Package
碩士 === 國立成功大學 === 工程科學系專班 === 93 === A 0.3 million pixels CMOS image sensor chip was assembled to a glass substrate by flip chip techniques. 3 kinds of package designs were proposed in this study. The dissimilarities among the 3 designs were in metal joints, die attach adhesives of anisotropic con...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24201745696917677919 |