Reliability Study of a Flip Chip Type CMOS Image Sensor Package

• Main Authors: Liang-Tien Lu, 呂良田
• Other Authors: Huei-Huang Lee
• Format: Others
• Language: en_US
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/24201745696917677919

碩士 === 國立成功大學 === 工程科學系專班 === 93 === 　　A 0.3 million pixels CMOS image sensor chip was assembled to a glass substrate by flip chip techniques. 3 kinds of package designs were proposed in this study. The dissimilarities among the 3 designs were in metal joints, die attach adhesives of anisotropic conductive film (ACF) or nonconductive paste (NCP), and with or without metal sealing. The experiment results revealed the samples with ACF had better reliability in temperature cycling test (TCT) than the samples with NCP. Also, the phenomena of crack at die attach adhesive and glass that occurred in the NCP system did not happen to the ACF system. The metal joints reliability was enhanced by using metal sealing. ANSYS was utilized to simulate the stress in the packages and show consistent results with the TCT reliability test. The DMA and TMA detection indicated the Tg and modulus of ACF was significantly lower than that of NCP. Also, the curing temperature used for ACF was lower compared to NCP. These factors formed lower stress to ACF system during temperature drop and caused these results.