A Study of Mold Adhesion in Shear and Normal Directions for EMC
碩士 === 國立成功大學 === 工程科學系碩博士班 === 93 === In IC packaging, when epoxy molding compound（EMC）is filling the mold cavity and cured in the mold, adhesion effects occurs in the interface between mold surface, substrate, leadframe and EMC. Adhesive effects cause many problems, which may influence the ejecti...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85141635257454133120 |