Structural Analysis and Performance Improvement of Flip Chips in Thermal Bonding Processes
碩士 === 逢甲大學 === 機械工程學所 === 93 === This research is aimed to investigate the stress distribution in the bumps on a narrow-long flip chip under thermal bonding process. In thermal bonding process, the flip chip bears not only a downward pressure from the thermal head, but also a thermal loading via he...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51472338985973454213 |