The Thermal Conductivity and Physical Properties of PP/α-Al2O3
碩士 === 逢甲大學 === 材料與製造工程所 === 93 === Abstract The composites filled with ceramic powder, α-Al2O3, were widely applied in electronic devices, such as semiconductor seal material, dissipation pad, thermal pad, thermal grease etc. In this paper, commercialized α-Al2O3 were used as fillers to enhance...
Main Authors: | Wen-Chi Hsieh, 謝文啟 |
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Other Authors: | none |
Format: | Others |
Language: | zh-TW |
Published: |
2005
|
Online Access: | http://ndltd.ncl.edu.tw/handle/33722085006865635813 |
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