| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 93 === Abstract
As a result of the recent development in the electronic products towards miniaturization, high power density, and high frequency, the corresponding energy dissipation per unit area of them is increasing, leading to the associated problems related to the heat dissipation. The heat-dissipating modules intend to remove heat from the central processing units (CPUs) to maintain their stable operation; however, serious considerations must be given to the proper design of the related parameters involved in the effectively reduction of the CPUs’ level of temperature.
Heat dissipating fins, heat pipes, fans, and heat spreaders are the most widely used energy-dissipating devices so far. This study used the heat-dissipating modules made up of these devices to be used in the desk-top personal computers. The analytical tool used for this study is the ICEPAK software to determine the fluidic and thermal fields inside these modules. The results obtained from this study indicated that a low-speed circulation flow existed in the neighborhood of the axis of the cooling fan, resulting in a reduction in the heat being removed.
Furthermore, this work performed parametric studies related to the speeds of the fans, flow rates, static pressures, and the number of fins. The results obtained from these studies indicated that for a specific performance curve of the fan, an increase in the number of fins led to an enhancement of the heat transport; however, as the number of fins was increased, the effectiveness of heat transfer dropped as a result of an increase in the flow resistance of the system under consideration.
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