| Summary: | 碩士 === 中原大學 === 化學工程研究所 === 93 === In this study, the silica gel was prepared to be the porous adsorbent by using the sol-gel process. In order to reduce the heat transfer resistance of the heat exchanger in the adsorption cooling system, the copper nanopowder was added to the sorbent to improve the heat conductivity of the composite adsorbent. The heat and mass transfer resistance for water vapor were discussed by the amount of copper nanopowder and the concentration of the binder.
From the result, the structure of the silica gel was affected by adding the copper nanopowder. The specific surface area, pore volume, and average pore size increased with the amount of additive. When adding the copper nanopowder were 0.2g, the structure was insignificant change. Because of adding the copper nanopowder had the effect on the structure of silica gels. After grinding these adsorbent, the specific surface area and pore volume of the sorbent without copper nanopowder would be reduced first and then raised according to the reducing of the particle size. And the average pore size would be raised with the same condition. However, the specific surface area and pore volume of the sorbent adding 0.6g copper nanopowder would keep changeless with reducing the particle sizes. And the average pore size would be raised with the same condition.
The heat conductivity of the silica gels were improved by adding the copper nanopowder and increased with concentration of the binder. The mass transfer resistance was increased by adding the copper powder. But mass transfer resistance of the silica gels of the adding copper powder were affected mainly by the structure of the silica gel. It was not affected by the amount of adding additive. In addition, the uptakes for water vapor were similar to the amount of the pore volume in these adsorbents.
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