The Computer Chassis Shock Simulation and Testing Analysis

• Main Authors: Cheng-Ta Wu, 吳承達
• Other Authors: Chao-Ming Wang
• Format: Others
• Language: en_US
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/12365798968541581494

碩士 === 大同大學 === 機械工程研究所 === 92 === This research is centered on the shock test analysis and test examination for PC chassis. Due to extremely short duration of shock test, it is therefore quite difficult to realize the shocking response. This research is adopted with 2 methods — the finite element analysis and shock test for examination. The dynamic behaviors of chassis shock; through the finite element and experiment for truth examination, we propose the adequate design improvement for structure design. In order to satisfy the evaluation purpose for chassis to reach before tooling development. The Pro/Mechanica with the finite element is to be use dynamic analysis, 3G simulations and dynamic shock simulation for computer chassis. Will forecast that overall behavior of dynamics for the shock on the computer chassis and also compare with the experimental results to improve the model modification; thereafter, the design improvement on computer chassis to create the analysis evaluation methods for the computer chassis. The shock test is aimed to understand the maximum indicating value of shock resistance for product. The large value means that the product comes with higher reliability. Within this research, that performs various directional shocks onto products to investigate the arisen shock pulse. Through shock test, can find out the structure weakness of products for improvement and also enhance the product reliability. The experimental results not only help us to understand the possible deformation happening to chassis but also examine the reasonability for the finite element analysis. Under the process of the finite element analysis, the static simulation and experimental come with 10%~15% error and find that the front board and rear EMI (Electromagnetic Interference) linkage parts will be affected with hi-stressing zones under shock test. This result is in conformity with the experimental outcome so that further make the design improvement by means of the finite element analysis and eliminate the original hi-stressing area. This article is adopted with simulation and test to create the evaluation models for PC chassis design. We have proposed some improvement plans for chassis design and effectively improve the deformation and interior damage with the products availably pasting the requirements of IEC (International Electrotechnical Commission) specification. We adopt the analysis and evaluation methods mentioned in this research to forecast the shock behaviors more severely. It is aimed to help designers develop and pre-estimate the product strength and also improve to solve the problems with the purpose to shorten design duration and reduce cost and exalt the industry competence.