Surfactant Removal of Copper Ion and Abrasive Colloidal Contamination in the Post-CMP

碩士 === 國立臺北科技大學 === 材料及資源工程系碩士班 === 92 === The size of Ultra- Large- Scale- Integration (ULSI) components is getting smaller. Traditionally, aluminum interconnects are used as connecting materials. However, as a result of high electrical resistivity of aluminum, the amount of the interconnects layer...

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Bibliographic Details
Main Authors: Hsiang-An Kung, 孔祥安
Other Authors: Jyh-Herng Chen
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/00981667077625437663

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