Amberlite XAD-4 Modificated by Ozone and Surface Grafting Clear Copper Ion Pollution in CMP Procedure
碩士 === 國立臺北科技大學 === 材料及資源工程系碩士班 === 92 === In the semi conductor process, copper ion existed in two steps: in copper depositing on Si wafer surface; the other one was in post-CMP cleaning. our research provides a novel method to solve the trouble that copper ion existing in semi-conductor waste wate...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90572558202781500630 |