Amberlite XAD-4 Modificated by Ozone and Surface Grafting Clear Copper Ion Pollution in CMP Procedure

• Main Authors: Gin-Ton chiu, 邱俊棠
• Other Authors: Jyh-Herng Chen
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/90572558202781500630

碩士 === 國立臺北科技大學 === 材料及資源工程系碩士班 === 92 === In the semi conductor process, copper ion existed in two steps: in copper depositing on Si wafer surface; the other one was in post-CMP cleaning. our research provides a novel method to solve the trouble that copper ion existing in semi-conductor waste water. The most efficient way is combining ozonation and sulfonation of PEG on the resin to adsorb copper ion. Ozone applied in many way, water treatment、disinfection、deodorant、avoid suspend particles、oxidation of organic material、decolorization、cleaner and so on. It also used with UV or peroxide, that called a AOPs(Advance Oxidation processes). Our research would accord the concept , to apply AOPs on surface modification of resin. Thrashing the topic that details reacting between chemical structure and AOPs, then getting the result we want. Sulfonation is an important unit operation and has been developed for a period, applied for many aspect. Our research combines sulfonation and AOPs to produce surface modification resin used in post-CMP copper adsorption. PEG is the key to combine two processes, by grafting the sulfonation PEG on AOPs surface modification resin, we get the new type resin that we want.