The Application of Wetting Balance Method to Solderability Analysis of the Electronic Components
碩士 === 國立臺北科技大學 === 工業工程與管理研究所 === 92 === The joints of assembly function as the supply of power and transform for signal of electronic devices. The assembly interface and soldering techniques comprise diverse joint types in which the printed circuit board of assembly is the most important one which...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81055706940001156634 |