| Summary: | 碩士 === 國立臺灣科技大學 === 機械工程系 === 92 === In this article we use molecular dynamic to simulate the copper thin film and panel model. The models divide to three parts：bending, bending combine with tensing and tensing with duplex axial. We calculate x-, y-and z-axial of force in the rigid body layer of three models. We use molecular dynamic match up the CST concept with finite element method. First of all, we define atoms as nodes to obtain the displacements of atoms in the simulation. Second of all, use the CST concept to obtain the strains and equivalent strain of each element in three axial. Third of all, using the elastic stress-strain function with finite element method to calculate the stress and equivalent stress of each element in three axial. Finally, use the strains and stresses of each element to calculate the strains, stresses, equivalent strain and equivalent stress of each atom in three axial. Therefore, we can use above-mentioned strains and stresses values to understand the strains and stresses contour distributions in each section of the model and compare the different of the distributions with the macro phenomenon when the models were loaded.
In this article the another propose is analyzing the loaded situation in the elastic range of nano-scale element. In three analysis models, first we calculate the x-, y-and z-components of force caused by forces of each atom in rigid body layer of the element. Second, calculate the x-,y-and z-components of force caused by potential of each atom in free body layer of the element. Finally, amount above-mentioned three axial components of force respectively that can obtain the total forces in three axial. Moreover it helps to understand the force values and variation in the elastic range of the nano-scale element.
The result of this study helps to understand the elastic stress-strain behavior of the model, indicating an important basic and new direction on the elastic field for nano-scale elements.
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