Robust Design of Hot Embossing Microlens Array Process

• Main Authors: Ou Han Tai, 歐漢泰
• Other Authors: Ching-Kong Chao
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/75659662388775494023

碩士 === 國立臺灣科技大學 === 機械工程系 === 92 === Due to the common use of microlens array in photoelectric industry, the research of microlens manufacturing tech becomes an important issue in today''s world. There are many methods to manufacture microlens. In this article we focus on the hot embossing method. The molds and the microlens are not contact in the hot embossing process; therefore, the produced microlens surfaces are well precision. However, the robust degree of microlens is usually poor. During the process of Ni-mold, high stress usually deforms Microlens. There are two primary purposes in this research, manufacturing robust photo-resist structures and low stressed Ni-mold. According to the analysis, the S/N ratio of the produced microlens array is 41.24, which is higher than the initial design 29.63. The result shows that the produced microlens array is robust. In this article, we use the Taguchi method and neural network to achieve the above two primary purposes. Besides, the experimental works is made to prove the correctness of theories. The conclusion from those experiments shows that the thickness of photo-resist layer is the primary factor which highly affects the change of photo-resist diameter during the process of photo-resist structure. On the other side, the most significant factor for stress is pH value. The stress of Ni-mold will be the lowest under the following process parameter conditions: 0.23% of saccharin, 4.05 pH value, temperature under 53˚C and 50mA/cm2 of the current density. Finally, we use variation analysis to obtain the contribution of control factors under two methods, photo-resist process and electroforming process.