| Summary: | 碩士 === 國立臺灣大學 === 機械工程學研究所 === 92 === The research applies the concept of high latten heat of boiling liquid to design a new type of heat removal device: “Thermosyphon Vapor Chamber, TSVC” and combine it with fans to make it a heat removal module. The system heat removal ability was studied under three different variables: （1）heating rate, (2)filling ratio of working fluid , and (3)types of boiling plate through the experiment method. Simultaneously, theory models and semi-experimental correlations of all parts of the system were established to bring further steps to researchers, too.
The experimental results showed that the heat removal ability of TSVC was determined by evaporating resistance and condensing resistance. As the heating rate increased, evaporating resistance became lower and condensing resistance became higher, but the total resistance was lower in a whole. The system can be operated steadily while the filling ratio were 12.9㏄and17.3㏄. Flooding phenomenon was occurred in E1002 and E1402 etching plates while the filling ratio is 8.6㏄,its made the heat removal ability of system become lower, and the heat removal ability of system became lower while the filling ratio was too much, too. The boiling heat transfer rates was increased by the etching plates of E1002 and E1402.
The heat removal ability of TSVC in this research was highest under E1002 etching plate and the filling ratio was 17.3㏄, all kinds of resistances and total resistance got a lowest value（0.527℃/W）, which was 25％higher than smooth copper plate in the same conditions.
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