Interfacial Reactions of Sn-Ag-Cu Solders in Ball Grid Array Packages
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 92 === Due to the hazard of lead for human bodies and environments, lead-free solders are started to investigate. Among many lead-free solders, a series of Sn-Ag-Cu alloys is considered one of the most potential materials so we focus on the six various compositions...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65231264520572045862 |