A Study of Polishing Technique for CVD DiamondThin Films—Thermo chemical Polishing andChemical-Assisted Mechanical Polishing andPlanarization

• Main Author: 邱思齊
• Other Authors: 左培倫
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/77230053617430858559

碩士 === 國立清華大學 === 動力機械工程學系 === 92 === Chemical vapor deposited diamond thin firm technique is generally applied in the years. Because of the characteristic of polycrystalline diamond, it must be polished in final processes to improve the quality of surface for widely application. In many polishing technologies, thermo chemical polishing and chemical assisted mechanical polishing and planarization (CAMPP) both have the advantages: large area polishing, fine polished surface and low equipment cost. In this article they will be experimented and analyzed. To realize the effect of the parameters in thermo chemical polishing and chemical assisted mechanical polishing and planarization, and to achieve large area polishing, they are analyzed for the variation of surface roughness, material removal rate…etc. And a theory model is set to compare the ideal value and true value, to know the polishing process in thermo chemical polishing and chemical assisted mechanical polishing and planarization. Keywords: Chemical vapor deposited diamond thin firm (CVDD), thermo chemical polishing, chemical assisted mechanical polishing and planarization (CAMPP)