Reliability of Wafer-Level CSP Under Cyclic Bending Test
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === According to the fast development of portable electronic devices, their characteristics are inclined to miniature profile and lightweight. Nowadays, the wafer-level package (WLP) has been widely applied in portable electronic devices for its miniature profil...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83241670385360042846 |