Deposition and characterization of thin film CuAlSe2

碩士 === 國立中山大學 === 材料科學研究所 === 92 === We use molecular beam deposition (MBD) system to grow CuAlSe2 thin film. The films have been characterized by electrical measurements but also by X-ray diffraction, electron probe microanalysis, optical measurements, scanning electron microscopy and photoluminesc...

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Main Authors: Shiang-hui Tsai, 蔡王向卉
Other Authors: Bae-heng Tseng
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/95048733427599553116
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spelling ndltd-TW-092NSYS51590282015-10-13T13:05:07Z http://ndltd.ncl.edu.tw/handle/95048733427599553116 Deposition and characterization of thin film CuAlSe2 CuAlSe2薄膜成長與分析 Shiang-hui Tsai 蔡王向卉 碩士 國立中山大學 材料科學研究所 92 We use molecular beam deposition (MBD) system to grow CuAlSe2 thin film. The films have been characterized by electrical measurements but also by X-ray diffraction, electron probe microanalysis, optical measurements, scanning electron microscopy and photoluminescence. It is shown that CuAlSe2 thin film is chalcopyrite structure with a band gap of 2.65eV, p-type conductivity and the smallest resistivity is 1.26×102(��-cm). When we raise the Cu/Al flux ratio (in the range of Cu/Al=0.5~0.65), the amounts of Cu is higher, the resistivity is lower and the grain size of second phase CuSe is larger and closer. After KCN etching, the resistivity increases due to the elimination of second phase CuSe. Bae-heng Tseng 曾百亨 2004 學位論文 ; thesis 61 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立中山大學 === 材料科學研究所 === 92 === We use molecular beam deposition (MBD) system to grow CuAlSe2 thin film. The films have been characterized by electrical measurements but also by X-ray diffraction, electron probe microanalysis, optical measurements, scanning electron microscopy and photoluminescence. It is shown that CuAlSe2 thin film is chalcopyrite structure with a band gap of 2.65eV, p-type conductivity and the smallest resistivity is 1.26×102(��-cm). When we raise the Cu/Al flux ratio (in the range of Cu/Al=0.5~0.65), the amounts of Cu is higher, the resistivity is lower and the grain size of second phase CuSe is larger and closer. After KCN etching, the resistivity increases due to the elimination of second phase CuSe.
author2 Bae-heng Tseng
author_facet Bae-heng Tseng
Shiang-hui Tsai
蔡王向卉
author Shiang-hui Tsai
蔡王向卉
spellingShingle Shiang-hui Tsai
蔡王向卉
Deposition and characterization of thin film CuAlSe2
author_sort Shiang-hui Tsai
title Deposition and characterization of thin film CuAlSe2
title_short Deposition and characterization of thin film CuAlSe2
title_full Deposition and characterization of thin film CuAlSe2
title_fullStr Deposition and characterization of thin film CuAlSe2
title_full_unstemmed Deposition and characterization of thin film CuAlSe2
title_sort deposition and characterization of thin film cualse2
publishDate 2004
url http://ndltd.ncl.edu.tw/handle/95048733427599553116
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AT càiwángxiànghuì cualse2báomóchéngzhǎngyǔfēnxī
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