| Summary: | 碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 92 === The environment for IC industry has been changing continuously and rapidly, the competition in global market getting tougher and tougher, the product life cycle greatly getting shorter, and the customer’s demands getting much more diverse and unpredictable. As the down stream of the IC industry, packing industry has to face such a changing environment and to deliver various innovative packing technologies. Bump Chip Carrier (BCC) is a new IC packing technology developed recently under such a demanding circumstance. There is so huge variety that exists in the manufacturing process of the IC packing in general, or BCC packing in specific, and yet the industry has to satisfy the strong demand in quick delivery, high quality, and low cost. As a consequence, pursuing agility and efficiency in manufacturing control have been their challenge issue that the industry has to face to.
In this research, an operation model for the agile manufacturing execution control in BCC packing was proposed. The proposed operation model consists of two major parts . The first part is the manufacturing engineering knowledge model which can represent all the possible variations in product structure, facility structure, and manufacturing process in a BCC packaging company. The second part is the operation control model which can fully utilize the manufacturing engineering knowledge to handle the complicated operation variations in shop floor manufacturing execution. EPC(Event-Driven Process Chain) was employed to represent the proposed operation control model . Through integration of the proposed models of manufacturing engineering knowledge and operation control, it will be helpful to implement an agile manufacturing system with the features of quick delivery, high flexibility, and easy reconfiguration in BCC packing industry, or IC packaging industry in general.
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