Bonding Process for the Vibrating Ring Gyro

• Main Authors: Pin-Tso Cheng, 鄭斌佐
• Other Authors: Wei-Hua Chieng
• Format: Others
• Language: en_US
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/9dw8jn

碩士 === 國立交通大學 === 機械工程系所 === 92 === Anodic bonding is a quite popular process used in fabricating micro sensors since it is a glass-to-silicon bonding process with reliable bonding strength in lower temperature (<500℃). It is applied in the fabrication of our vibrating ring gyro, but we suffered the problem that the part of non-bonding region was bonded to glass. We rough the non-bonding region to reduce the situation that non-bonding region was boned to glass. Initially, we used the thick photoresist (PR) as DRIE process mask, but the photoresist reflow is very serious. It will influence the width and the depth of the structural gap. We use SiO2 instead of thick PR as DRIE etching mask and successfully solve the PR reflow problem.