| Summary: | 碩士 === 國立交通大學 === 電子工程系所 === 92 === Infra-Red sensors are promising components in the field of MEMS. The technologies in MEMS can be divided into bulk micromaching and surface micromaching. Among them, surface micromaching is easier to be integrated and more compatible with integrated circuits(IC). Another advantage of surface micromaching is its high fill factor. Thus, surface micromaching is believed to be the niche of the ULSI generation.
In this work, we use the surface micromaching to fabricate suspended membranes for Infra-Red sensors (microbolometers). In order to avoid melting aluminum interconnects within the integrated circuit, all processes were done at low temperature. Furthermore, the computer simulation was used to predict and discuss all possible factors which may deteriorate the device performance. With these considerations, a good suspended membrane for microbolometer applications, with low residual stress and processed at low temperature was successfully realized.
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