Designs for Broadband Vertical Transitions Using Microstrip-Fed Cavity Couplers

• Main Authors: Gui-Qiang Huang, 黃貴強
• Other Authors: Eric S. Li
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/83626891385061305184

碩士 === 國立暨南國際大學 === 電機工程學系 === 92 === Broadband vertical transitions using microstrip-fed cavity couplers are studied in this thesis. Conventional via holes connecting signals from different layers of circuit boards pose fabrication difficulty and poor performance for high-frequency applications. The proposed design not only provides broadband property, the electrically thick ground plane can also serve as heat sink for thermal dissipation of on-board active components. Finite element method is chosen to perform the required simulations of the design due to its accuracy. The validity of the simulation results is verified experimentally. For millimeter-wave applications, sensitivity study is conducted to show the robustness of this design, which is not susceptible to any dimension error and misalignment during fabrication process.