Effects of Cooling Rate and Cu/Ni-P/Au UBM on Microstructure and Tensile properties of Sn-Ag-xSb Lead-Free Solder Joints.
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 92 === This study is to discuss the effect of Sb additions (0~3.86 wt%) as well as the cooling rate(slowly cooling, 1.68℃/sec、fast cooling, 5.03℃/sec) upon the microstructure ad the interfacial metallic compound variations of Sn-Ag solder joints combined with Cu/Ni...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32256b |