| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 92 === Along with the semiconductor rapid development, the electronic products tend to the high efficiency, the low size. The questions of radiation are important more and more. Along with the semiconductor science and technology progress, the refrigeration efficiency of TEC also obtains the promotion. It’s merit causes it to become the best sharp weapon of solve the questions of radiation.
This article refers to each reference documents and set up one-dimensional Module, and utilizing Fortran simulation. Then discusses its influence of radiating surface and the heat sink, in addition, can willfully change each parameter, and we can clearly understand it’s action by the numerical analysis result, and improve the cold design according to its shortcomings.
When we review those reference documents, We discovers that category of scholars research is all on one-dimensional Module, but in fact each parameter of TEC change not only one-dimension, so we have the necessity to discuss its work in three-dimensional. Therefore the final goal of this article is to construct three-dimensional Module, and prove the accuracy of three-dimensional Module by the one-dimensional result, in order to approaches situation of the fact
|
|---|
