Investigation of Indentation Process and Quantitative Evaluation of Thin Film Mechanical Properties Using Molecular Dynamics Simulation

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 92 ===   Mechanical properties of diamond, gold and nickel films were investigated by nanoindentation experiments and molecular dynamics (MD). Molecular dynamics is used to describe the atomistic interface behavior under indentation. The Tersoff potential function wa...

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Bibliographic Details
Main Authors: Cheng-Liang Liu, 劉政良
Other Authors: Jen-Fin Lin
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/71922472540550849465
Description
Summary:碩士 === 國立成功大學 === 機械工程學系碩博士班 === 92 ===   Mechanical properties of diamond, gold and nickel films were investigated by nanoindentation experiments and molecular dynamics (MD). Molecular dynamics is used to describe the atomistic interface behavior under indentation. The Tersoff potential function was used to describe the behavior of carbon atoms and gold and nickel atoms were described by the TB-SMA potentials. The results showed that both the hardness and Young’s modulus of the films are decreased as the temperature increased. The hardness and Young’s modulus are increased with increasing loading rate. Compared with nanoindentation experiments and MD result it can obtain that the indentation load and penetration became weaker as the film was thinner due to the size effect. Under the same loading rate, the hardness and Young’s modulus decreased due to the increasing penetration depth. Furthermore, because of the indenter’s wear and compressive occurrence under indentation, the hardness could be under-estimated using determination for the projection contact area.