A study of thermal performance of the liquid cooling modules

• Main Authors: ku-feng chao, 趙谷峰
• Other Authors: Jung-Hua Chou
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/5964ar

碩士 === 國立成功大學 === 工程科學系碩博士班 === 92 === 　　With the development of semiconductor manufacturing technology, the power dissipation of the microprocessor raises. Conventional cooling-by-air methods will be limited when the power dissipation increases. To accomplish high power dissipation, small liquid cooling modules have emerged for personal and notebook computers. 　　In this study, liquid cooling modules are study experimentally with different cooling liquids, flow rates, radiator angles, and the cold plate under free convection/ forced convection. The results indicate that the thermal resistance of liquid cooling modules changes little with different radiator angles. When the flow rates of cooling liquids, water or EG, increase, the surface temperature of the simulation chip is reduced and the cooling efficiency increases. Comparing with free convection, the efficiency can be improved by 10-15% for power dissipation from 30 W to 70 W with the addition of heat sink and a fan on the cold plate. The cooling efficiency of water is better than that of EG with the same flow rate of 1.1 LPM.